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下载世博(Industry Plan)

  电子下载发展迅速,其竞争压力和市场需求促使其开发周期缩短。随着全球移动化趋势的发展,设计的产品需要能够承受各种潜在的加载场景和环境条件。
  允若科技在电子产品热设计、手机版兼容性手机版与验证以及电子产品机械性能优化设计与验证方面积累了丰富的经验,充分利用这些优化和手机版工具可以改进产品性能、降低生产和包装的材料使用量。
  温升过高是导致电子产品失效的重要原因,电子产品热设计可以模拟电子产品内部温度分布和热流路径、优化冷却世博,从而提高电子产品的可靠性。
典型应用领域
• 跌落与冲击试验
• 强度试验(应力与应变)
• 全局—局部冲击分析
• 耐久性与疲劳
• 钎焊接头分析
• 振动分析

  With the rapid development of the electronic industry, its competitive pressure and market demand make its development cycle shorten. At the same time, with the development of global mobile trend, products design needs to be able to withstand various potential loading scenarios and environmental conditions.
  We have accumulated rich experience in thermal design, EMC Simulation and verification of electronic products, and optimization design and verification of mechanical properties of electronic products. Making full use of these optimization and simulation tools can improve product performance and reduce material usage in production and packaging.
  Excessive temperature rise is an important cause of failure of electronic products. Thermal design of electronic products can simulate the internal temperature distribution and heat flow path of electronic products, optimize the cooling scheme, thereby improving the reliability of electronic products.
 
Typical Application Domains:
  • Drop and impact test
  • Strength test (stress and strain)
  • Global-local impact analysis
  • Durability and fatigue
  • Analysis of brazed joints
  • Vibration analysis

 


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