With the rapid development of the electronic industry, its competitive pressure and market demand make its development cycle shorten. At the same time, with the development of global mobile trend, products design needs to be able to withstand various potential loading scenarios and environmental conditions.
We have accumulated rich experience in thermal design, EMC Simulation and verification of electronic products, and optimization design and verification of mechanical properties of electronic products. Making full use of these optimization and simulation tools can improve product performance and reduce material usage in production and packaging.
Excessive temperature rise is an important cause of failure of electronic products. Thermal design of electronic products can simulate the internal temperature distribution and heat flow path of electronic products, optimize the cooling scheme, thereby improving the reliability of electronic products.
Typical Application Domains:
Drop and impact test
Strength test (stress and strain)
Global-local impact analysis
Durability and fatigue
Analysis of brazed joints